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Bond With The Best.
TaNFilm® wire-bondable resistor and capacitor chips IRC offers its proven tantalum nitride thin film technology in ultra-miniature silicon or ceramic-based wire-bondable die, providing space savings, precision and reliability that thick film chips can’t match – at prices that keep your designs competitive. • Single chips, center-tapped dual chips, networksand capacitors • Resistor chips at 20 mil square; two-resistor networks at 30 mil square • Multiple contact pads for shortest available wire bond paths • Resistance values from 10 Ohms to 1M Ohms; tolerances to ±0.1%; TCR tracking to ±2ppm/°C • Capacitance values from 10pf to 1000pf in sizes from 20x20 mils to 60x60 mils • Custom designs, pad layouts and network configurations available 
IRC’s Home Page > Request a sample > Find a Rep >
Info. and Technology Links:
Wire Bondable Chip Resistors on Ceramic And Silicon Substrates [PDF] 8.21M Wire Bondable Ceramic Resistors [PDF] Wire Bondable Chip Capacitors [PDF] Wire Bondable Multi-tap Chip Resistors [PDF] Wire Bondable Resistor/ Capacitor Circuits [PDF] Wire Bondable Resistor Network Arrays [PDF] Wire Bondable Voltage Divider Network [PDF] Seen in the Media: Click here for the latest press releases on IRC’s wire-bondable chips
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